Since launching one year ago, the OECD’s Semiconductor Informal Exchange Network (SIEN) continues to strengthen global semiconductor supply chains through collaboration with more than 50 global economies and nongovernmental stakeholders. In its first year, the network has enhanced cooperation among semiconductor policymakers and experts, promoted transparency in policymaking affecting the semiconductor ecosystem, and facilitated emergency response planning for supply chain disruptions.
The network is supported by funding from the U.S. Department of State’s International Technology Security and Innovation (ITSI) Fund, established under the CHIPS Act of 2022.
Other notable achievements of SIEN include:
- A mutually agreed-upon classification system, or shared taxonomy, that streamlines data exchange and early warning communication between network members.
- A mapping exercise that utilizes trade data to pinpoint comparative advantages and dependencies in semiconductor supply chains.
- A framework paper exploring global semiconductor policies to boost transparency and coordination between like-minded economies.
- A tabletop exercise that enhanced participants’ understanding of semiconductor ecosystems and supply chain dynamics.
At the sixth SIEN meeting June 18 in Italy, Deputy Assistant Secretary for Trade Policy and Negotiations Robert Garverick announced the United States’ intent to provide financial support to the network through December 2025, subject to the availability of funds. The next quarterly meeting will be hosted by the United Kingdom in London.
Participants from the following economies joined the meeting: Argentina, Austria, Belgium, Brazil, Bulgaria, Canada, Chile, Colombia, Costa Rica, Croatia, Czechia, Denmark, Dominican Republic, Egypt, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, India, Indonesia, Ireland, Israel, Italy, Japan, Korea, Latvia, Lithuania, Luxembourg, Mexico, the Netherlands, New Zealand, Norway, Panama, Peru, the Philippines, Poland, Portugal, Romania, the Slovak Republic, Slovenia, Spain, Sweden, Switzerland, Taiwan, Türkiye, the United Kingdom, the United States, Vietnam, and the European Union.
For more information, please visit the U.S. Department of State International Technology Security and Innovation Fund.
Official news published at https://www.state.gov/global-semiconductor-network-drives-strong-collaboration-among-partners/